Books
2 results found| Title | Authors | Description | OpenBook ID | |
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Advances in CMP/polishing technologies for the manufacture of electronic devices | Ioan D. Marinescu,Toshiro K. Doi,Syuhei Kurokawa | CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover. | OL16565398W |
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Chemical-Mechanical Planarization of Semiconductor Materials | Michael R. Oliver | This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of … | OL19834006W |