Advances in CMP/polishing technologies for the manufacture of electronic devices

By Ioan D. Marinescu, Toshiro K. Doi, Syuhei Kurokawa

Subjects: Technical & Manufacturing Industries & Trades, TECHNOLOGY & ENGINEERING, Grinding and polishing, Electrolytic polishing, Chemical mechanical planarization

Description: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.