Chemical-Mechanical Planarization of Semiconductor Materials

By Michael R. Oliver

Subjects: Structural control (Engineering), Electronics, Grinding and polishing, Optical materials, Physical organic chemistry, Surfaces (Physics), Semiconductors

Description: This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.