Books

5 results found
Title Authors Description OpenBook ID
Copper interconnect technology Copper interconnect technology Christoph Steinbruchel viii, 122 p. : 26 cm OL11210373W
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® Erdogan Madenci Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software pa… OL19849541W
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages Gerard Kelly This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plasti… OL19902233W
The Archaeology of Syria The Archaeology of Syria Peter M. M. G. Akkermans,Glenn M. Schwartz This book is the first comprehensive presentation of the archaeology of Syria from the end of the Paleolithic period to 300 BC. Although Syria has been the focus of intensive excavations for decades,… OL3859728W
Lead-Free Soldering in Electronics Lead-Free Soldering in Electronics Katsuaki Suganuma Assessing the scientific and technological aspects of lead-free soldering, this reference considers the necessary background and requirements for proper alloy selection-highlighting the metallurgical… OL8561934W