Lead-Free Soldering in Electronics

By Katsuaki Suganuma

Subjects: Nonfiction, TECHNOLOGY & ENGINEERING, Solder, Digital, Solder and soldering, Microelectronics, Electronic packaging, Engineering, Mise sous boîtier (Électronique), Soudure, Electronics

Description: Assessing the scientific and technological aspects of lead-free soldering, this reference considers the necessary background and requirements for proper alloy selection-highlighting the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics.