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Advanced Flip Chip Packaging
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Ho-Ming Tong |
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in w… |
OL19823935W |
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Dynamic-Mismatch Mapping for Digitally-Assisted DACs
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Yongjian Tang |
This book describes a novel digital calibration technique called dynamic-mismatch mapping (DMM) to improve the performance of digital to analog converters (DACs). Compared to other techniques, the D… |
OL19844417W |
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Proceedings of the FISITA 2012 World Automotive Congress
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Zhongguo qi che gong cheng xue hui |
<i>Proceedings of the FISITA 2012 World Automotive Congress </i>are selected from nearly 2,000 papers submitted to the 34th FISITA World Automotive Congress, which is held by Society of Automotive En… |
OL19896853W |
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Sensors
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Kourosh Kalantar-zadeh |
Sensors: An Introductory Course provides an essential reference on the fundamentals of sensors. The book is designed to help readers in developing skills and the understanding required in order to im… |
OL19901663W |