Books
1 results found| Title | Authors | Description | OpenBook ID | |
|---|---|---|---|---|
|
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages | Gerard Kelly | This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plasti… | OL19902233W |